Thinning and backgrinding of wafers requires precise control of thickness, total thickness variation (TTV) and warp. SIC offers solutions for measurement of wafers and wafers on tape.
Substrate Thickness, Warp, and TTV Measurement with or without Tape for Wafer Backgrind and Etch Thinning processes. Non-contact Echoprobe Technology. Thin film and surface roughness options.
