Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in inert gas. Non-Contact Laser Scanning Technology.

Models: 500TC |  

Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.

Models: 900 C2C | 900TC-VAC |  

Film adhesion testing of thin films and stacks on substrates for material evaluation.

Models: MELT | Aquaflex |  

Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.

Models: Raman-360 |  

Contact and Non-Contact sheet resistance measurement systems for implantation, diffusion, metallization, and many other applications.

Models: 4pp | RsL |  

Virtual Interface Technology for 3D-IC Metrology: TSV profile (depth, top & bottom CD) , Remaining Silicon Thickness (RST), Copper Nail Height, Bump Height and Cu pillar Height, Edge trim profile.

Models: VIT C2C | 8108 VITE |