普竞电子科技•FSM亚太区代理
普競电子創立於廣州，根植於美國硅谷，總部設立了亞太和歐美兩大市場區域。在歐洲、韓國、日本、中國（及台灣省）均設有分公司和辦事處。 同時我們擁有資深技術團隊百餘人，實現了對總部數據的共享和繼承。產品主要應用於半導體，集成電路，MEMS，以至互聯網，智能手機等領域，公司經過多年發展,累積了豐富的經驗及良好的口碑，可根據不同客戶的特殊需求,提供高品質的測試定製服務.
普競电子創立於廣州，根植於美國硅谷，總部設立了亞太和歐美兩大市場區域。在歐洲、韓國、日本、中國（及台灣省）均設有分公司和辦事處。 同時我們擁有資深技術團隊百餘人，實現了對總部數據的共享和繼承。產品主要應用於半導體，集成電路，MEMS，以至互聯網，智能手機等領域，公司經過多年發展,累積了豐富的經驗及良好的口碑，可根據不同客戶的特殊需求,提供高品質的測試定製服務.
我們提供領先的芯片檢測技術和儀器，產品集研發，適配，測試，製作，售後服務為一體，並與各大OEM廠商的合作，最大可滿足450mm的晶圓檢測計量，為晶圓廠降低製作成本和損耗。我們在壓力測量薄膜粘附試驗，晶片地形計量，電氣特性等方面有超過25年的經驗，客戶滿意度一直是我們的唯一指標。
Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.
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Silicon Concepts is the leading manufacturer of stress measurement tools for semiconductor, MEMS, optoelectronic, and flat panel applications. Stress and wafer bow maps can be acquired over the entire wafer surface, providing process engineers means to characterize and develop new processes using different thin film materials.
Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of...
Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.
...型號: Raman-360 |
Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in inert gas. Non-Contact Laser Scanning Technology.
...型號: 500TC |
Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Manual loading, auto-mapping. Warp, Roughness, and Thin Film Thickness measurement options. Systems up to 300mm diameter wafers with or without frame.
Rapid Thermal Mechanical Characterization of novel materials. Simulataneous extraction of stress hysteresis, thermal desorption, film shrinkage and reflectivity data during thermal cycling in vaccum up to 900 degree C. Fully automated cassette to cassette system for 300mm wafers. SECS/GEM option.
4-Point Bend film adhesion test. Measurement in air or liquid. For low to mid adhesion samples. Multi-chamber option for rapid testing.
